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- Impact of Thermal Cycling Frequency on IGBT Power Module Lifetime hal link

Auteur(s): PELLECUER Guillaume, Huselstein Jean-Jacques, Martiré Thierry, Forest François, Chrysochoos A., Arnould O.

Conference: PCIM Europe 2022, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (Nuremberg, DE, 2022-05-10)
Actes de conférence: , vol. p. ()


Ref HAL: hal-03668732_v1
Exporter : BibTex | endNote
Résumé:

The paper presents the impact of thermal cycling frequency on the lifetime of IGBT power module. The first part will be devoted to a quick presentation of the test bench. Then, the test protocols will be detailed as well as the measurement protocol to characterise the ageing of the power module wirebonds. An important part will be devoted to the results of ageing. Before concluding, mechanical tensile tests on bondwires will complete the ageing tests.



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