|Fast active cycling power test bench using dedicated modules assemblies for studying wire bond ageing |
Auteur(s): Pellecuer Guillaume, Huselstein Jean-Jacques, Forest François, Chrysochoos A., Bontemps Serge
Conference: Conférence PCIM Europe (Nuremberg, DE, 2019-05-07)
Ref HAL: hal-02042449_v1
Exporter : BibTex | endNote
This paper presents the design of specific samples dedicated to the test of power bond wires (300 µm diameter). The aim is to totally control the test conditions on each bond wire while reducing drastically the power consumption. The samples are integrated in a particular test bench that allows conducting easily ageing tests with an on-line monitoring. The main idea is to solder Power MOSFET dies used as heating sources on an Integrated Metallic Substrate having a high thermal impedance. First, the paper describes the design process, aided by Finite Element simulations. A second part focuses on the realization of the samples and of the test bench. Finally, the first ageing results are presented.